EC and Clearen Sheet have been used and
reputed as standard materials for carrier tapes.
Various grades available for semiconductors and electronic components.
Years of accumulation and trust
Completed carrier tapes for semiconductor and electronic parts
3. Ultra-thin and high strength EC-AP sheet for parts miniaturization developed recently.
Product Features |
|
Structure | EC-R | EC-M3 | EC-AP2 | CST-2401 |
Surface | Conductive PS | Conductive PS | Conductive PC | Special PS（single layer） |
Core | PS | ABS | ABS | |
Surface | Conductive PS | Conductive PS | Conductive PC |
Sheet Properties and Applications (Sheet thickness: 0.3mm) | ||||||
Item | Unit | Method | EC-R | EC-M3 | EC-AP2 | CST-2401 |
Color | - | - | Black | Black | Black | Clear |
Surface Resistivity | Ω | JIS K 7194 | 104 - 106 | 104 - 106 | 104 - 106 | 1014 < |
Hertz | % | JIS K 7105 | - | - | - | 20 |
Tensile ( Yield) | MPa | JIS K 7127 | 21 | 43 | 50 | 39 |
Tensile (break) | MPa | 22 | 42 | 41 | 31 | |
Modulus | MPa | 1420 | 1730 | 1720 | 1630 | |
| Application | Active Component | LSI |  | | | |
| Discreet |  | | | |||
| Passive Component（connectors etc.） | | |||||
| High Weight Device | | | | | ||
| Vacuum Trays (module) | ||||||
Each items of NEXTECK win years of accumulation and trust. Products used for semiconductors and electronic parts are very completed and with varied shaping methods，excellent forming property and size precision.
